JPH0165171U - - Google Patents
Info
- Publication number
- JPH0165171U JPH0165171U JP1987159344U JP15934487U JPH0165171U JP H0165171 U JPH0165171 U JP H0165171U JP 1987159344 U JP1987159344 U JP 1987159344U JP 15934487 U JP15934487 U JP 15934487U JP H0165171 U JPH0165171 U JP H0165171U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible
- flexible circuit
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987159344U JPH0165171U (en]) | 1987-10-20 | 1987-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987159344U JPH0165171U (en]) | 1987-10-20 | 1987-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165171U true JPH0165171U (en]) | 1989-04-26 |
Family
ID=31440473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987159344U Pending JPH0165171U (en]) | 1987-10-20 | 1987-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165171U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018014437A (ja) * | 2016-07-21 | 2018-01-25 | キヤノン株式会社 | 部品の実装方法及び電子モジュール |
-
1987
- 1987-10-20 JP JP1987159344U patent/JPH0165171U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018014437A (ja) * | 2016-07-21 | 2018-01-25 | キヤノン株式会社 | 部品の実装方法及び電子モジュール |